MUMBAI, India, Oct. 12 -- Intellectual Property India has published a patent application (202641118148 A) filed by Dr. Jayaprakash Venugopal; Dr. S. Kumar; Dr. S. Ganesan; Dr. M. Anish; R. Kiruthika; Dr. G. Prabha; and Mr. M. Sudhakar on October 01, 2026, for High Bending Modulus Natural-Fiber-Reinforced Thermoplastic Composite Hollow Deck Board And Process For Manufacture Thereof.
Inventors include Dr. Jayaprakash Venugopal; Dr. S. Kumar; Dr. S. Ganesan; Dr. M. Anish; R. Kiruthika; Dr. G. Prabha; and Mr. M. Sudhakar.
The application for the patent was published on October 09, 2026, under issue no. 41/2026.
Abstract: A high bending modulus natural-fiber-reinforced thermoplastic composite hollow deck board and a process for manufacture thereof are disclosed. The board comprises a thermoplastic matrix, natural reinforcing fibers, an interfacial coupling component, an upper load-bearing skin, a lower skin, opposed side walls and longitudinal internal ribs defining hollow cells. The skin regions are configured to have a higher effective longitudinal reinforcement parameter than at least one region nearer the neutral bending axis by controlled fiber orientation, retained aspect ratio, local consolidation, fiber concentration, interfacial coupling and/or reduced void content. The ribs stabilize the skins and transfer shear while the hollow cells reduce mass. Manufacturing includes fiber drying and classification, controlled compounding, devolatilization, hollow-profile extrusion with longitudinal flow orientation, and calibration with controlled cooling to preserve reinforced skin and rib regions. Optional surface densification or a compatible weather-resistant cap layer improves environmental durability while maintaining structural continuity. Accompanied Drawing [FIGS. 1-2].
Disclaimer: Curated by HT Syndication.
