MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202647074541 A) filed by Hewlett-Packard Development Company, L. P. on June 16, 2026, for Heatsink System With Manifold.
Inventor includes Dowell, Daniel D..
The application for the patent was published on June 26, 2026, under issue no. 26/2026.
Abstract: A system includes an inlet, an outlet, a plurality of heatsink cells, including a first heatsink cell and a second heatsink cell, and a manifold structure to fluidically couple the plurality of heatsink cells with the inlet and the outlet. The manifold structure can include an inlet fluid connector to receive coolant from the inlet and direct the coolant into the plurality of heatsink cells, the inlet fluid connector including a first inlet pathway fluidically coupled with the first heatsink cell and a second inlet pathway fluidically coupled with the second heatsink cell, and an outlet fluid connector to receive the coolant from the plurality of heatsink cells and direct the coolant into the outlet, the outlet fluid connector including a first outlet pathway fluidically coupled with the first heatsink cell and a second outlet pathway fluidically coupled with the second heatsink cell.
Disclaimer: Curated by HT Syndication.
