MUMBAI, India, Sept. 28 -- Intellectual Property India has published a patent application (202541024029 A) filed by Jain Deemed-To-Be University on March 18, 2025, for Heat Shrink Wire Installation Device.
Inventor includes Dr. Adarsha H.
The application for the patent was published on September 25, 2026, under issue no. 39/2026.
Abstract: A heat shrink wire installation device, comprising a rectangular base 101 having a plurality of suction cups disposed underneath base 101 for a mounting of base 101 on a flat surface, a pair of robotic grippers 102 installed on base 101 for holding wires for joining, a robotic arm 103 positioned on base 101 for fetching an insulation from a container 104 disposed on base 101 to sleeve onto wires for joining, a telescopic link mounted on a sliding unit and having a C-shaped member 105 having a plurality of hot air blowers for blowing hot air onto insulation for shrinking of insulation over wires and an artificial intelligence-based imaging unit 106 with a laser sensor determine position and dimensions of wires to be joined.
Disclaimer: Curated by HT Syndication.
