MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202617076084 A) filed by Starwarden B. V. on June 19, 2026, for Heat Pipe.
Inventors include Maassen, Nick; and Davalos Segura, Stephanie.
The application for the patent was published on July 31, 2026, under issue no. 31/2026.
Abstract: The present invention provides a heat pipe comprising: a. an elongate envelope encasing at or towards its first end an evaporator section, at or towards its second end a condenser section, and an adiabatic section intermediate the evaporator and condenser sections; b. at least one first channel providing for fluid communication of an evaporated working fluid from the evaporator section to the condenser section; c. at least one second channel providing wicking means effective for transferring a condensed working fluid from the condenser section to the evaporator section, the first and second channels communicating with each other in the condenser and in the evaporator sections of the first channel; d. at least one coolant channel integrated within the envelope and adapted to transfer, by means of an internal flowing coolant, heat away from one or both of the first and second channels.
Disclaimer: Curated by HT Syndication.
