MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202644005893 A) filed by Unick Corporation on January 21, 2026, for Heat Dissipation Structure For Semiconductor Package Module And Electronic Device Including The Same.
Inventors include Eui-Dong Roh; Wook-Hyun; Tae-Yong Kim; Seung-Min; and Min-Ho Kang --.
The application for the patent was published on July 24, 2026, under issue no. 30/2026.
Abstract: The present disclosure relates to a heat dissipation structure for a semiconductor package module capable of more effectively dissipating heat generated by a semiconductor device, and an electronic device including the same, in which circuit patterns are provided on at least one surface of a substrate, a semiconductor device is mounted on one surface of the substrate on which the circuit patterns are provided, and a heat dissipation trace for dissipating heat generated by the semiconductor device is formed on the substrate.
Disclaimer: Curated by HT Syndication.
