MUMBAI, India, June 24 -- Intellectual Property India has published a patent application (202617063702 A) filed by Huntsman Advanced Materials Switzerland Gmbh on May 20, 2026, for Heat De- And Rebondable, In-Situ Polymerized Resin Composition.
Inventors include Lakkaichi, Adem; Storz, Christof; and Cherkaoui, Zoubair.
The application for the patent was published on June 12, 2026, under issue no. 24/2026.
Abstract: The present invention relates to a de- and rebondable polymer prepared from the reaction between a difunctional mercaptan hardener; and a difunctional thiol-reactive resin. The resultant polymer has a softening point greater than about 70 °C, preferably about 90 °C to about 150 °C.
Disclaimer: Curated by HT Syndication.
