MUMBAI, India, June 26 -- Intellectual Property India has published a patent application (202541008077 A) filed by Manipal Academy Of Higher Education on January 30, 2025, for Harnessing Microneedle Patch For Diabetic Wound Treatment And A Method Of Preparation Thereof.
Inventors include Aman Pratap Singh; Shashi Rashmi U; Deepanjan Datta; Raviraj V. Acharya; and Prasad S S.
The application for the patent was published on June 19, 2026, under issue no. 25/2026.
Abstract: The present disclosure pertains to topical or transdermal delivery of an active substance in a therapeutically effective amount. In particular, the present disclosure provides a microneedle patch for the treatment of diabetic ulcers and a method for preparing thereof. The patch directly delivers the localized drug to the ulcer site, ensuring enhanced therapeutic effectiveness and reduced systemic side effects.
Disclaimer: Curated by HT Syndication.
