MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202647102053 A) filed by Kyocera Corporation on August 24, 2026, for Hard Material Member, Cutting Insert, Cutting Tool, And Method For Manufacturing Cut Workpiece.
Inventors include Iwai, Naoki; and Makino, Takahiko.
The application for the patent was published on September 18, 2026, under issue no. 38/2026.
Abstract: This hard material member comprises a base body including a hard phase and a binder phase. The hard phase contains tungsten carbide and nitrogen. The binder phase contains nitrogen and at least one iron group element selected from the group consisting of iron, cobalt, and nickel. The base body has an outside portion in a range up to 1 mm from the surface, and an inside portion positioned inside the outside portion in the depth direction from the surface. The hard phase contains a plurality of hard phase particles. The plurality of hard phase particles include: a plurality of first particles having crystal defects spreading in a mesh-like pattern, wherein the area ratio of the region in which the crystal defects spread in a cross section is 50 (%) or more; and a plurality of second particles having crystal defects, wherein the area ratio of the region in which the crystal defects spread in a cross section is less than 50 (%). The number of the first particles per unit area in the outside portion is greater than the number of the first particles per unit area in the inside portion.
Disclaimer: Curated by HT Syndication.
