MUMBAI, India, June 26 -- Intellectual Property India has published a patent application (202627010908 A) filed by Huawei Technologies Co. , Ltd.; and Dalian University Of Technology on February 02, 2026, for Haptic Evaluation Method And Device.
Inventors include Xu, Rui; Qin, Yi; Liu, Qian; and Chen, Junru.
The application for the patent was published on June 19, 2026, under issue no. 25/2026.
Abstract: A haptic evaluation method and device. The method comprises: acquiring application layer parameters and network side parameters of a target service, wherein the application layer parameters comprise haptic information of the target service, and the network side parameters comprise at least one of the latency, reliability or jitter of the target service; and on the basis of the application layer parameters and the network side parameters, determining a haptic evaluation indicator of the target service, wherein the haptic evaluation indicator is used for evaluating the quality of user haptic experience of the target service. The haptic evaluation method and device in the embodiments of the present application can save time and labor costs, and can improve the accuracy of haptic evaluation.
Disclaimer: Curated by HT Syndication.
