MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202641090597 A) filed by Mr. Vignesh K; Dr. B. I. Andrew; Dr. R. Rathinam; Dr. Sivaranjanee R; Dr. Narender Singh; and Susindhiran S on July 24, 2026, for Graphene-Enhanced Polymer Composite For Electromagnetic Interference Shielding In 5g Communication Devices.
Inventors include Mr. Vignesh K; Dr. B. I. Andrew; Dr. R. Rathinam; Dr. Sivaranjanee R; Dr. Narender Singh; and Susindhiran S.
The application for the patent was published on July 31, 2026, under issue no. 31/2026.
Abstract: The present invention relates to a graphene-enhanced polymer composite for electromagnetic interference (EMI) shielding in 5G communication devices and a method for manufacturing the same. The invention addresses the increasing need for lightweight, flexible, and high-performance EMI shielding materials capable of protecting high-frequency electronic systems operating in sub-6 GHz and millimeter-wave (mmWave) frequency bands. The composite comprises a polymer matrix reinforced with uniformly dispersed graphene nanoplatelets, which form an interconnected conductive network that effectively attenuates electromagnetic waves through reflection, absorption, dielectric polarization, conductive losses, and multiple internal reflections. In one embodiment, the composite may further include secondary conductive nanofillers such as carbon nanotubes, graphite, carbon black, MXenes, or conductive metallic nanoparticles to enhance electrical conductivity, thermal conductivity, and shielding effectiveness. The composite is fabricated using ultrasonic-assisted dispersion, solution blending or high-shear mixing, followed by molding and curing processes to achieve uniform filler distribution and strong interfacial bonding. The developed material exhibits excellent electromagnetic shielding effectiveness, improved thermal stability, enhanced mechanical strength, corrosion resistance, and reduced weight compared with conventional metallic shielding materials. The invention is suitable for manufacturing device enclosures, printed circuit board (PCB) shielding layers, antenna housings, communication modules, wearable electronics, automotive radar systems, aerospace electronics, medical equipment, Internet of Things (IoT) devices, defense communication systems, and other high-frequency electronic applications. The invention provides a scalable, cost-effective, and durable solution for next-generation EMI shielding requirements in advanced wireless communication technologies.
Disclaimer: Curated by HT Syndication.
