MUMBAI, India, June 26 -- Intellectual Property India has published a patent application (202431030007 A) filed by National Institute Of Technology Silchar on April 13, 2024, for Grafting Of S-S Disulfide Bond On Tio2 Nanoparticle For A Self-Healed, Thermoformable, And Fracture Resistance Epoxy Nanocomposites And Its Method Of Preparation.
Inventors include Sudipta Halder; Samit Roy; Anubhav Saikia; Lakshi Nandan Borah; Subhankar Das; and Md Saruk Ahamed.
The application for the patent was published on June 19, 2026, under issue no. 25/2026.
Abstract: The present invention relates to a self-healed, thermoformable, and fracture resistance epoxy nanocomposites and its method of preparation. Functionalized TiO2 nanoparticles is used for preparing self-healed epoxy nanocomposites with enhanced fracture resistance properties along with improved thermoformability, reprocessability, and thermomechanical behaviors. The TiO2 nanoparticles are functionalized with a silane coupling agent followed by grafting with reversible SS disulfide bonds to avoid the direct inclusion of reversible S-S disulfide bonds in epoxy networks.
Disclaimer: Curated by HT Syndication.
