MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202641093416 A) filed by Dr. Swarna S; K. S. School Of Engineering And Management; and Dr. Santhosh N on July 31, 2026, for Functionally Graded Conductive Interlayer For Mesh-Free Resistance Welding Of Metallic–thermoplastic Sandwich Structures.
Inventors include Dr. Swarna S; K. S. School Of Engineering And Management; and Dr. Santhosh N.
The application for the patent was published on September 18, 2026, under issue no. 38/2026.
Abstract: The present invention relates to a functionally graded conductive interlayer for mesh-free resistance welding of metallic–thermoplastic sandwich structures. The sandwich structure comprises upper and lower metallic face sheets, a thermoplastic core, and functionally graded conductive interlayers disposed between the metallic face sheets and the thermoplastic core. Each conductive interlayer includes a conductive region, a transition region, and a bonding region having a graded distribution of electrically conductive filler across its thickness. The graded architecture provides controlled electrical conductivity and promotes localized Joule heating at the bonding interfaces during resistance welding. In the disclosed method, electrical current is supplied through electrodes positioned at the exposed edges of the functionally graded conductive interlayers while compressive pressure is simultaneously applied to the assembled sandwich structure. The localized Joule heating softens the adjacent thermoplastic material, resulting in permanent bonding between the metallic face sheets and the thermoplastic core without the use of conventional embedded metallic meshes, resistance wires, metallic foils, or other auxiliary conductive heating elements. The invention provides improved bonding uniformity, reduced thermal distortion, simplified structural configuration, reduced manufacturing complexity, and enhanced structural integrity. The metallic–thermoplastic sandwich structure and the associated welding method are suitable for lightweight structural applications in aerospace, automotive, railway, marine, defence, civil engineering, renewable energy, and related industries.
Disclaimer: Curated by HT Syndication.
