MUMBAI, India, June 24 -- Intellectual Property India has published a patent application (202615059847 A) filed by Apple Inc. on May 11, 2026, for Full Die And Partial Die Tape Outs From Common Design.
Inventors include Hauzi, Haim; Tamari, Eran; Hammarlund, Per H.; Redshaw, Jonathan M.; Kostianovsky, Alfredo; Nissel, Idan; Gitelman, Leonid; Betzalel, Oren; Haim, Dalia R. Filed On; and Zimet, Lior.
The application for the patent was published on June 12, 2026, under issue no. 24/2026.
Abstract: A chip design methodology and a set of integrated circuits that are taped out from a common design database are disclosed. The area of a full instance of the integrated circuit is defined, and one or more chop lines are defined to identify 5 portions that will be removed for one or more partial instances. A variety of techniques and mechanisms are defined to permit the tape outs to occur from a common design database, so that the effort to tape out partial instances may be minimized beyond that to tape out the full instance. 10
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