MUMBAI, India, Oct. 26 -- Intellectual Property India has published a patent application (202644044901 A) filed by Pou Chen Corporation on April 08, 2026, for Foam Mold.
Inventors include Liang-Feng Sun; Chih-Hsien Lin; Huei-Ting Zeng; and Hung-Sheng.
The application for the patent was published on October 23, 2026, under issue no. 43/2026.
Abstract: ABSTRACT FOAM MOLD A foam mold (1000) includes a mold main body (1200), and the mold main body (1200) has a height direction and includes a foam space (S1) and a first core (1220) connected to the foam space (S1). The first core (1220) includes a porous layer (1222, 2241) and a through hole layer (1221, 2242). The porous layer (1222, 2241) faces to the foam space (S1) and is made by a 3D printing technique, the through hole layer (1221, 2242) and the porous layer (1222, 2241) are connected integrally, the through hole layer (1221, 2242) includes a plurality of through holes (1221b, 2242b), and an extension direction of each of the through holes (1221b, 2242b) is parallel to the height direction. The Relevant Figure is Fig. 1.
Disclaimer: Curated by HT Syndication.
