MUMBAI, India, Sept. 28 -- Intellectual Property India has published a patent application (202631111072 A) filed by Indian Institute Of Technology Indian School Of Mines, Dhanbad on September 16, 2026, for Flow-Controlled Meshed Channel-Based Site-Specific Substrate Cooling System For Welding Or Waam Applications.
Inventors include Md Sajid Hussain; Raushan Kumar; Vishal Kumar; Manoranjan Kumar Mahto; and Amitava Mandal.
The application for the patent was published on September 25, 2026, under issue no. 39/2026.
Abstract: A flow-controlled meshed channel-based substrate cooling system for welding or wire arc additive manufacturing (WAAM) applications comprises a refrigeration unit (101), a circulation pump (102), and a substrate cooling bed (117) having an internal meshed serpentine channel network (304, 305, 306, 307) with inlet ports (109, 110, 111, 112) and outlet ports (113, 114, 115, 116). Chilled coolant is supplied through inlet pipelines (108), each associated with an independently operable flow control valve (103, 104, 105, 106) and a flow meter (107), and is returned through outlet pipelines (118) to the refrigeration unit (101). Thermocouples (408, 409, 410, 411) mounted on the cooling bed (117) and connected to a data acquisition system monitor temperature at multiple substrate zones. Selective actuation of the flow control valves enables site-specific, zone-wise cooling, while simultaneous actuation provides substantially uniform cooling, thereby facilitating controlled thermal management and cooling-rate characterisation during welding or WAAM operations.
Disclaimer: Curated by HT Syndication.
