MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202617064355 A) filed by Vanchip Tianjin Technology Co. , Ltd. on May 21, 2026, for Filter Packaging Structure And Manufacturing Method Therefor.
Inventor includes Su, Xiaoyu.
The application for the patent was published on June 26, 2026, under issue no. 26/2026.
Abstract: Provided in the present invention is a manufacturing method for a filter packaging structure. The manufacturing method comprises: providing a carrier plate having a roof structure formed on a surface, wherein the roof structure comprises a roof attached to the surface of the carrier plate and a supporting wall located on the roof; providing a substrate having a resonant structure formed on a surface, wherein the resonant structure comprises a resonant body and electrodes located at two sides of the resonant body, and a surface of each electrode comprises a first region close to the resonant body and a second region away from the resonant body; bonding the carrier plate and the substrate, wherein the supporting wall is bonded to the first regions of the electrodes, and the substrate, the supporting wall and the roof enclose a cavity required for operation of the resonant body; removing the carrier plate, such that the second regions of the electrodes are exposed; and forming conductive structures on the second regions of the electrodes. In this way, a cavity forming method in which the cavity is formed by providing the roof on the supporting wall is avoided; therefore, the reliability of the packaging structure is high, and the thickness of the filter packaging structure can also be reduced. Further provided in the present invention is a filter packaging structure.
Disclaimer: Curated by HT Syndication.
