MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202617063950 A) filed by Vanchip Tianjin Technology Co. , Ltd. on May 20, 2026, for Filter And Packaging Method Therefor.
Inventors include Xu, Xian; Feng, Dandan; Lin, Hongkuan; and Zhang, Xinyao.
The application for the patent was published on June 26, 2026, under issue no. 26/2026.
Abstract: Provided in the present invention is a filter packaging method. The filter packaging method comprises: providing a substrate, wherein a resonance structure is formed on the surface of the substrate, the resonance structure comprises a resonance body and electrodes located on two sides of the resonance body, and the surface of each electrode comprises a first area close to the resonance body and a second area away from the resonance body; forming walls in the first areas on the electrodes, the walls surrounding the resonance body; forming a second thin film layer on a carrier plate, and performing a patterning treatment on the second thin film layer to form a roof; aligning the surface of the carrier plate where the roof is formed with the surface of the substrate where the resonance structure is formed, and then bonding the roof to the walls so as to form a cavity required for the operation of the resonance body; and removing the carrier plate. In this way, the problems of an uneven covered film and a poor bonding strength of the covered film when the film covers the wall to manufacture a cavity can be prevented, thereby improving the reliability of a filter; moreover, the process cost is low, the control difficulty is small, and the yield of finished products is high. Further provided in the present invention is a filter manufactured by using the packaging method.
Disclaimer: Curated by HT Syndication.
