MUMBAI, India, June 19 -- Intellectual Property India has published a patent application (202617057791 A) filed by Honeywell International Inc. on May 06, 2026, for Extruded Thermoplastic Foams And Uses In Applications Requiring Strength And Lightweight.
Inventors include Abrevaya, Hayim; Lehuta, Keith; and Martins, Susie.
The application for the patent was published on June 05, 2026, under issue no. 23/2026.
Abstract: Disclosed are extruded foam comprising an extruded thermoplastic, closed-cell foam having at least a first surface and comprising: (i) thermoplastic polymer cell walls formed by an extrusion step, with the walls being comprised of at least about 0.5% by weight of ethylene furanoate moieties and optionally one or more co-monomer moieties; (ii) blowing agent contained in at least a portion of said closed cells; and a material different than said thermoplastic, closed-cell foam attached to and/or integral with at least a portion of said first foam surface.
Disclaimer: Curated by HT Syndication.
