MUMBAI, India, Aug. 17 -- Intellectual Property India has published a patent application (202541012365 A) filed by Nokia Technologies Oy on February 13, 2025, for Enhancements To Enable Inter-Cu And Intra-Cu Ltm Coexistence In Dual Connectivity.
Inventors include Ayaz Ahmed; Srinivasan Selvaganapathy; Anastasios Kakkavas; Chitradeep Majumdar; and Endrit Dosti.
The application for the patent was published on August 14, 2026, under issue no. 33/2026.
Abstract: ENHANCEMENTS TO ENABLE INTER-CU AND INTRA-CU LTM COEXISTENCE IN DUAL CONNECTIVITY Various example embodiments relate to devices, methods, apparatuses and computer readable media for enabling inter-CU and intra-CU LTM coexistence in dual connectivity. A terminal device may be configured to transmit, to a secondary node, a measurement report to trigger a SCG LTM preparation; receive, from a master node, an inter-CU SCG LTM configuration comprising one or more candidate SCG configurations for one or more inter-CU candidate PSCells, and an intra-CU MCG LTM configuration comprising one or more candidate MCG configurations of the serving master node in association with the one or more candidate secondary nodes; and store the received inter-CU SCG LTM configuration and intra-CU MCG LTM configuration. Abstract Drawing: FIG. 4
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