MUMBAI, India, Aug. 17 -- Intellectual Property India has published a patent application (202617079210 A) filed by Tomoegawa Corporation on June 26, 2026, for Electrostatic Chuck.
Inventors include Adachi Ayana; and Moriuchi Hideki.
The application for the patent was published on August 14, 2026, under issue no. 33/2026.
Abstract: An electrostatic chuck (1) comprises a dielectric layer (10) and a first resin layer (20) provided on the dielectric layer (10). The first resin layer (20) has a holding surface for holding a member to be held. The first resin layer (20) has an elastic modulus of 10-1000 MPa at 40°C in a region in contact with the dielectric layer (10).
Disclaimer: Curated by HT Syndication.
