MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202617049423 A) filed by Analog Power Conversion LLC; and Kyosan Electric Manufacturing Co. , Ltd. on April 17, 2026, for Electronic Module Configured For Thermal Management.
Inventors include Gendron-Hansen, Amaury; Gu, Wang-Chang Albert; Sdrulla, Dumitru Gheorge; Takata, Tetsuya; Yuzurihara, Itsuo; Yoneyama, Tomohiro; and Hosoyamada, Yu.
The application for the patent was published on June 26, 2026, under issue no. 26/2026.
Abstract: An electronic module performing a power function comprises a substrate and a plurality of semiconductor dies disposed on the substrate. The plurality of semiconductor dies operates together to perform a power device function. The semiconductor dies may be identical. The semiconductor die may have a high length-to- width (i.e. aspect) ratio in order to improve the thermal performance of the electronic module. The semiconductor die may be disposed on the substrate in a uniformly spaced pattern to improve the thermal performance, which pattern may be a hexagonal pattern, a linear pattern, or a rectangular pattern. The electronic module may also comprise a driver device coupled to and configured to control the plurality of semiconductor dies. The driver device may be disposed on the substrate between a first semiconductor die of the plurality of semiconductor dies and a second semiconductor die of the plurality of semiconductor dies.
Disclaimer: Curated by HT Syndication.
