MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202617076250 A) filed by Samsung Electronics Co. , Ltd. on June 19, 2026, for Electronic Device Comprising Ground Structure Of Conductive Layer.
Inventors include Kim, Hyunsoo; Lee, Jongwon; Kim, Sangjun; Kim, Sujung Number; Bae, Hankook; Chung, Myungkyoon; and Choi, Taekkyun.
The application for the patent was published on July 10, 2026, under issue no. 28/2026.
Abstract: This electronic device may comprise: a bracket; printed circuit board; integrated circuitry (IC) electrically connected to at least another component of the electronic device through the printed circuit board; a shield member which is disposed on the IC and the printed circuit board, and which includes a conductive layer for shielding the IC from electromagnetic interference (EMI); a first conductive gasket, which is disposed between the conductive layer and the printed circuit board, is in contact with a part of the conductive layer and electrically connects the conductive layer to a ground of the printed circuit board; and a second conductive gasket which is disposed between the conductive layer and the bracket, and which is at least partially disposed on the part of the conductive layer in contact with the first conductive gasket.
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