MUMBAI, India, Aug. 31 -- Intellectual Property India has published a patent application (202617081789 A) filed by Xiamen Hongfa Electric Power on July 02, 2026, for Electromagnetic Relay.
Inventors include Chen, Weijie; Zhong, Shuming; Wang, Congjun Wo No; and Li, Fangneng.
The application for the patent was published on August 28, 2026, under issue no. 35/2026.
Abstract: Provided in the present application is an electromagnetic relay, comprising a relay body and a lead-out plate, wherein the lead-out plate is connected to a reed of a contact part of the relay body and extends to the outside of a housing of the relay body, the part of the lead-out plate that is located inside the housing of the relay body is defined as an internal lead-out part, and the part of the lead-out plate that is located outside the housing of the relay body is an external lead-out part. The electromagnetic relay further comprises a magnetically-conductive magnetic shielding member, the magnetic shielding member being wrapped around the external lead-out part located outside the housing of the relay body. After a current enters the external lead-out part, a generated magnetic field is concentrated on the magnetic shielding member; in this way, the influence of an external magnetic field generated by an external assembly on the internal magnetic field of the relay can be effectively reduced, so as to ensure the reliability of the electromagnetic relay.
Disclaimer: Curated by HT Syndication.
