MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202611075776 A) filed by Gla University, Mathura on June 18, 2026, for Electrically Controlled Phase Change Material-Based Smart Building Envelope System.
Inventor includes Dr. Rishabh Chaturvedi.
The application for the patent was published on August 07, 2026, under issue no. 32/2026.
Abstract: The present invention relates to an electrically controlled phase change material-based smart building envelope system for adaptive thermal management in buildings. The system comprises a multilayer wall panel including an Exterior Finish Layer (1), Structural Board Layer (2), Thermal Insulation Layer (3), Nano-Enhanced PCM Layer (4), Electrical Triggering Layer (5), Interior Board Layer (6), and Interior Finish Layer (7). A Control Unit (8) receives thermal data from Temperature Sensors (9) and Heat Flux Sensors (10) and actively regulates phase transition within the Nano-Enhanced PCM Layer (4) using predictive phase-shift scheduling. Embedded resistive heating elements initiate controlled melting and solidification cycles to synchronize latent heat storage with peak thermal loads. The invention improves indoor thermal comfort, reduces HVAC energy consumption, and enables adaptive zonal thermal management for energy-efficient building applications.
Disclaimer: Curated by HT Syndication.
