MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202611101146 A) filed by Jawaaz Ahmad; Shahkar Ahmad Nahvi; Basharat Nabi Dar; and Design Innovation Centre, Islamic University Of Science And Technology on August 21, 2026, for Eco-Friendly Packaging System Using Biodegradable Compressed Husk Panels.
Inventors include Jawaaz Ahmad; Shahkar Ahmad Nahvi; and Basharat Nabi Dar.
The application for the patent was published on October 02, 2026, under issue no. 40/2026.
Abstract: The present invention relates to an eco-friendly packaging system utilizing biodegradable compressed husk panels as a sustainable substitute for plastic and thermocol. The system converts agricultural residues such as rice husk or coconut coir into compression-molded panels through a low-temperature hydraulic process using natural binders and additives. The molded panels incorporate micro-channels for cushioning and a thin bio-coating layer providing hydrophobicity and biodegradability. The invention further includes modules for curing, drying, trimming, and surface finishing, integrated with energy and moisture recovery subsystems and a recycling unit that re-pulpes rejected panels for reuse, forming a closed-loop sustainable cycle. The resulting packaging components exhibit excellent impact resistance, thermal insulation, and full compostability, making them suitable for consumer electronics, food, and industrial packaging applications.
Disclaimer: Curated by HT Syndication.
