MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202617064455 A) filed by S. A. Armstrong Limited on May 21, 2026, for Duty Based Modulating Hydronic Circuit Technology Method And Apparatus For Optimized Configuration Of Multiple Heat Pumps.
Inventors include Thomsen, Peter; Hum, Redmond; and Patel, Ritesh.
The application for the patent was published on July 24, 2026, under issue no. 30/2026.
Abstract: A hydronic system that can co-ordinate heat pumps, valves, and load circuits based on load-based and condition based factors to assess the optimal operating hydronic circuit configuration. In an example, the hydronic system includes: an air to liquid heat pump hydronically connected to a first load circuit; a liquid to liquid heat pump interfacing with a second source circuit having a hydronically connected to a second load circuit; a water storage hydronically connected to the second load circuit, and hydronically connected to a water consumption circuit having a water supply input and a water consumption output; at least one 3-way valve which hydronically connects the air to liquid heat pump to the liquid to liquid heat pump; and at least one controller configured to co-ordinate control of the at least one 3-way valve, the air to liquid heat pump, and the liquid to liquid heat pump.
Disclaimer: Curated by HT Syndication.
