MUMBAI, India, July 24 -- Intellectual Property India has published a patent application (202418092462 A) filed by Composecure, LLC on November 26, 2024, for Dual Interface Metal Smart Card With Booster Antenna.
Inventors include Lowe, Adam; Herslow, John; Dasilva, Luis; and Nester, Brian.
The application for the patent was published on July 17, 2026, under issue no. 29/2026.
Abstract: A card (10) having a metal layer (30) and an opening (402) or cut-out region in the metal layer (30), with a dual-interface integrated circuit (IC) module (7) disposed in the opening or cut-out region. A ferrite layer (44) is disposed below the metal layer (30) and a booster antenna (47) is attached to the ferrite layer (44). A vertical hole (362, 436b) extends beneath the IC module (7) through the ferrite layer (44). The booster antenna (47) may be physically connected to the IC module (7) or may be configured to inductively couple to the IC module (7). In some embodiments, the IC may be disposed in or on a non-conductive plug (34, 434) disposed within the opening or cut-out region, or the vertical hole (362, 436b) may have a non-conductive lining, or a connector may be disposed between the booster antenna (47) and the IC module (7) in the vertical hole (362, 436b)
Disclaimer: Curated by HT Syndication.
