MUMBAI, India, Aug. 17 -- Intellectual Property India has published a patent application (202641096230 A) filed by Gudlyf Mobility Pvt Ltd on August 10, 2026, for Distributed Structural Architecture With Integrated Interface And Load Transfer Mechanism.
Inventors include Ajeet Babu Kumar Parasumanna; and Kumar Seshaier Parasumanna.
The application for the patent was published on August 14, 2026, under issue no. 33/2026.
Abstract: A distributed structural architecture is disclosed comprising an integrated interface arrangement for transferring loads between a structural body and an associated load- bearing assembly. The architecture includes an embedded interface member having an interlocking formation configured to establish mechanical engagement with a surrounding structural material, thereby providing resistance to axial displacement and rotational movement. A reinforced load-transfer region is arranged around the interface member to maintain substantially continuous load paths through the associated structural assembly. The integrated interface is formed during manufacture by controlled material consolidation around the interface member, thereby reducing reliance on separate sealing, fastening or bonding components. The architecture further includes controlled positioning and process parameters for forming the integrated interface with repeatable dimensional and structural characteristics. The disclosed arrangement improves load distribution, interface integrity, fatigue resistance, manufacturing consistency and structural reliability while reducing component count and assembly complexity.
Disclaimer: Curated by HT Syndication.
