MUMBAI, India, Aug. 31 -- Intellectual Property India has published a patent application (202621084901 A) filed by Ms. Aakanksha Bhawal; Ms. Vaishnavi Bhoir; Ms. Vrushali Katkar; Ms. Sakshi Mhatre; Ms. Gauri Pukale; Dr. Shrutika Patil; Dr. Pranati Tilak; and Dr. Meera Deshmukh on July 10, 2026, for Dissolvable Microneedle Transdermal Patches Comprising Diclofenac Sodium For Minimally Invasive Pain Management.
Inventors include Ms. Aakanksha Bhawal; Ms. Vaishnavi Bhoir; Ms. Vrushali Katkar; Ms. Sakshi Mhatre; Ms. Gauri Pukale; Dr. Shrutika Patil; Dr. Pranati Tilak; and Dr. Meera Deshmukh.
The application for the patent was published on August 28, 2026, under issue no. 35/2026.
Abstract: ABSTRACT The present invention discloses a dissolvable microneedle transdermal patch for minimally invasive pain management, comprising an array of microneedles formed from a biodegradable polymeric matrix of polyvinyl alcohol (PVA) and polyvinylpyrrolidone (PVP) with Diclofenac Sodium uniformly dispersed therein as the active pharmaceutical ingredient. The microneedle patch is fabricated by a mold casting technique involving preparation of a homogeneous drug-loaded polymeric solution, casting into microneedle molds, centrifugation for cavity filling and air removal, ambient drying, and demolding. The fabricated microneedles exhibit a height of 500–600 µm, tip radius of up to 70 µm, and diameter of 250–350 µm with an inter-needle spacing of approximately 300 µm. The patch demonstrates adequate mechanical strength for stratum corneum penetration, a dermal-compatible surface pH of 7.0, and a sustained drug release profile with approximately 86.89% cumulative release within 60 minutes. The invention provides a patient-friendly, self-administrable drug delivery system that bypasses first-pass metabolism, enhances bioavailability, reduces gastrointestinal adverse effects, and improves therapeutic outcomes for acute and chronic pain management.
Disclaimer: Curated by HT Syndication.
