MUMBAI, India, June 19 -- Intellectual Property India has published a patent application (202647068049 A) filed by Qualcomm Incorporated on May 30, 2026, for Devices Including One Or More High-Impedance Layers Between A Display Stack And An Ultrasonic Fingerprint Sensor Stack.
Inventors include Strohmann, Jessica Liu; Lin, Shiang-Chi; Li, Shaojui; Liu, Hsiang-Chi; Yang, Chia-Wei; Seo, Jae Hyeong; and Djordjev, Kostadin Dimitrov.
The application for the patent was published on June 05, 2026, under issue no. 23/2026.
Abstract: An apparatus may include a display stack, an ultrasonic sensor stack and a high-impedance stack including one or more high-impedance layers. The ultrasonic sensor stack may include an ultrasonic transceiver layer and an ultrasonic transceiver circuitry (UTC) layer. Each of the high-impedance layers may have an acoustic impedance that is higher than an acoustic impedance of the UTC layer. The high-impedance stack and the ultrasonic sensor stack may form an acoustic resonator bounded by the UTC layer and the high-impedance stack. The acoustic resonator may be configured to enhance the ultrasonic waves transmitted by the ultrasonic sensor stack at a peak frequency of the ultrasonic sensor stack. The peak frequency may be a frequency used by the ultrasonic sensor stack for obtaining fingerprint images. An apparatus stack portion that includes the ultrasonic sensor stack may have a thickness corresponding to a multiple of a quarter wavelength at the peak frequency.
Disclaimer: Curated by HT Syndication.
