MUMBAI, India, June 26 -- Intellectual Property India has published a patent application (202617022431 A) filed by Raytheon Company on February 25, 2026, for Device For And Method Of Frequency Testing Printed Circuit Board Under Thermal Stress.
Inventors include Northrup, Mark Ryan; Rodack, Andrew Ryan; Riley, Matthew E.; and Hamilton, Maxwell John.
The application for the patent was published on June 19, 2026, under issue no. 25/2026.
Abstract: A printed circuit board (PCB) test system and method including temperature chamber including at least one slot to accommodate at least one PCB test coupon, input bus connected to inputs of the at least one slot, and output bus connected to outputs of the at least one slot, wherein temperature chamber is configured to apply a temperature to the at least one PCB test coupon; signal generator including output bus connected to the input bus of the at least one slot, frequency meter comprising an input bus connected to the output bus of the at least one slot and an output bus, and a comparator connected to the output bus of the signal generator and the output bus of the frequency meter for comparing corresponding outputs of the signal generator and the frequency meter.
Disclaimer: Curated by HT Syndication.
