MUMBAI, India, June 19 -- Intellectual Property India has published a patent application (202617055490 A) filed by Robert Bosch Gmbh on April 30, 2026, for Device Comprising A Heat Sink And A Power Module.
Inventors include Kaltenecker, Soeren; and Stehlik, Daniel Michael.
The application for the patent was published on June 05, 2026, under issue no. 23/2026.
Abstract: The invention relates to a device comprising a heat sink (10) having a heat sink top side (11) and a power module (40) having a module underside (42), wherein the power module (40) is secured to the heat sink (10), wherein the module underside (42) faces the heat sink top side (11), wherein a solder layer (30) and a coating (20) are arranged between the power module (40) and the heat sink (10), wherein a coating underside (22) of the coating (20) is integrally bonded to the heat sink top side (11), wherein a solder underside (32) of the solder layer (30) is integrally bonded to a coating top side (21) of the coating (20) and a solder top side (31) of the solder layer (30) is integrally bonded to the module underside (42), characterized in that the module underside (42) of the power module (40) is designed to be inwardly curved and the coating top side (21) of the coating (20) has an elevation (25).
Disclaimer: Curated by HT Syndication.
