MUMBAI, India, June 26 -- Intellectual Property India has published a patent application (202441098827 A) filed by Agrihawk Technologies Private Limited on December 13, 2024, for Device And Method For Testing Soil Parameters.
Inventors include Dhankhar, Sanjeet; D S, Karan; and Sumit.
The application for the patent was published on June 19, 2026, under issue no. 25/2026.
Abstract: The present disclosure relates to a device (100) for testing soil parameters. The device (100) includes a longitudinal housing (102) having a first end (102a) adapted to be positioned proximate to a surface of the soil and a second end (102b) disposed opposite to the first end (102a) and adapted to be positioned at a depth from the surface. In addition, the device (100) includes a controller (108) disposed inside the longitudinal housing (102), and at least one transceiver (110) disposed inside the longitudinal housing 102 and electrically coupled with the controller (108), wherein the at least one transceiver (110) is configured to send and receive electromagnetic wave. The controller (108) is configured to compare the change in magnitude of the sent and received electromagnetic wave with a predefined value to determine a plurality of soil parameters.
Disclaimer: Curated by HT Syndication.
