MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202641072899 A) filed by Saveetha Institute Of Medical And Technical Sciences on June 12, 2026, for Development Of New Suture Material (kevcarb)over The Lacerated Wounds And Over The Joints To Prevent Wound Gapping.
Inventors include Dr Vidhyaalakshmi S; Dr Venkatesh G; and Deepak Nallaswamy Veeraiyan.
The application for the patent was published on June 26, 2026, under issue no. 26/2026.
Abstract: Suturing over joints is a very challenging one as it is prone for wound dehiscence owing t the flexion, extension and other movements of the joints. In this study, we propose development of a new suture material combining Kevlar ( para armid) and carbon fibre to overcome these challenges. The combination of Kevlar's high tensile strength and carbon fibre's flexibility and durability offers many advantages for wound closure over joints. T suture material demonstrates exceptional tensile strength, low tissue reactivity, flexibility, durability, and biocompatibility, making it suitable for suturing in high-stress environmen Furthermore, its unique nature minimizes tissue irritation and inflammation, particularly beneficial for suturing over joints where tissue movement and friction are prominent. Overall, the proposed suture material shows promise in providing improved outcomes for patients undergoing surgical procedures involving joint closure. Further research and development are warranted to optimize its design and assess its clinical efficacy.
Disclaimer: Curated by HT Syndication.
