MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202641077236 A) filed by Devi S; and Yuvarani S on June 23, 2026, for Development Of Antimicrobial Agro-Waste Reinforced Sandwich Panel For Sustainable Insulated Packagin.
Inventors include Devi S; and Yuvarani S.
The application for the patent was published on July 03, 2026, under issue no. 27/2026.
Abstract: The increasing demand for sustainable and eco-friendly packaging materials has led to the exploration of agricultural waste as a valuable reoource. The pre:;ent study focuses on the development of antimicrobial agro-waste reinforced sandwich panels for insulated pockaging applications. The panels are fabricated using agro-waste fibers such as banana pseudostem fiber and groundnut shell fiber as reinforcing materials, a lightweight insulating core, and a suitable biodegradable binder. NaturaTantimicrobialagents are incorporated to inhibit microbial growth and improve product safety during storage and transportation. The developed sandwich panels exhibit good thermal insulation, mechanical strength, biodegradability, and antimicrobial activity, making them a potential alternative to conventional plastic-based packaging materials. The utilization of agro-waste not only reduces environmental pollution but aloo adds value to agricultural residues, promoting a circular economy and sustainable packaging solutions.
Disclaimer: Curated by HT Syndication.
