MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202617091748 A) filed by Hyosung Heavy Industries Corporation on July 29, 2026, for Dc Capacitor Fixing Structure Of Sub-Module.
Inventors include Park, Hong Bean; and Jung, Hong Ju.
The application for the patent was published on October 30, 2026, under issue no. 44/2026.
Abstract: The present invention relates to a DC capacitor fixing structure of a sub-module, in which a spring member is installed inside a bushing body of a spring bushing and fitted and coupled to the outer circumferential surface of a capacitor terminal, thus making it easy to detach and attach a busbar and the capacitor terminal, and therefore reducing assembly and disassembly times during inspection and repair work on the sub-module.
Disclaimer: Curated by HT Syndication.
