MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202647114954 A) filed by Towa Corporation on September 25, 2026, for Cutting Device And Method For Manufacturing Cut Article.
Inventors include Kataoka Shoichi; Fukuda Hajime; Watanabe Hajime; Shimizu Takatoshi; and Miyata Kazushi.
The application for the patent was published on October 02, 2026, under issue no. 40/2026.
Abstract: A cutting device (1) for forming a groove on a second surface (41b) of a lead frame (41) of an object (4) to be cut comprises: a cutting table (22); a light source (33) that emits light to the second surface (41b) of the object (4) to be cut placed on the cutting table (22); a blocking member (34) that blocks a part of the light emitted from the light source (33); an imaging mechanism (31) that acquires a captured image of the second surface (41b); a height-changing mechanism (32) that can change the height of the imaging mechanism (31); and a calculation unit (35) that can execute an analysis process on the captured image. The imaging mechanism (31) has a lens (31b) that condenses the light on the second surface (41b), and an imaging unit (31a) that can acquire the captured image of the second surface (41b). The imaging unit (31a) acquires captured images at a plurality of different heights, and the calculation unit (35) calculates the height position of the second surface (41b) on the basis of the focusing state of the blocking member (34) in the captured images.
Disclaimer: Curated by HT Syndication.
