MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202644037987 A) filed by Dowa Metaltech Co. , Ltd. on March 27, 2026, for Cu-Ni-Si-Based Copper Alloy Sheet Material, Current-Carrying Parts, And Heat-Dissipating Parts.
Inventors include Jiang Wanqing; Nonogaki Taichi; and Hashimoto Takuya.
The application for the patent was published on October 02, 2026, under issue no. 40/2026.
Abstract: There is provided a copper alloy sheet material having a chemical composition, in mass%, of Ni: 1.0 to 5.0%, Si: 0.2 to 1.5%, S: 0.001 to 0.5%, Mn: 0.001 to 0.5%, Co: 1.5% or less, with a remainder being Cu and unavoidable impurities, and having a volume fraction of {200} crystal planes of 29% or more as determined from an X-ray diffraction pattern of a sheet surface.
Disclaimer: Curated by HT Syndication.
