MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202637090981 A) filed by Yinwang Intelligent Technologies Co. , Ltd. on July 27, 2026, for Coupling Platform, Coupling Method, And Related Apparatus.
Inventors include Liu, Jun; Xu, Yifan; and Hua, Kangjian.
The application for the patent was published on August 07, 2026, under issue no. 32/2026.
Abstract: The present application relates to the field of optoelectronics. Disclosed are a coupling platform, a coupling method, and a related apparatus. The coupling platform is used for coupling a first optoelectronic chip and a first optical element, the first optoelectronic chip being placed under an illumination condition. The coupling platform comprises: an imaging unit, a control unit and an adjustment unit, wherein the first optical element is arranged between the first optoelectronic chip and the imaging unit. By means of the coupling platform, the coupling between a first optoelectronic chip and a first optical element can be completed only by means of a control unit controlling an adjustment unit on the basis of a first image, and then making the adjustment unit execute a corresponding control instruction so as to adjust relative poses of the first optoelectronic chip and first optical element. There is no need to perform complex power-on and power-off processes, simple operations and low time consumption are achieved, and automatic assembly of optical products can also be realized, thereby reducing the cycle time of an optical product assembly process, and improving the assembly efficiency and the units per hour of optical products.
Disclaimer: Curated by HT Syndication.
