MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202617073321 A) filed by Nippon Steel Corporation on June 12, 2026, for Copper-Plated Steel Sheet.
Inventors include Tani, Komomo; Nakano, Tadashi; and Kohigashi, Yusuke.
The application for the patent was published on July 10, 2026, under issue no. 28/2026.
Abstract: A copper-plated steel sheet 10 comprises a base steel sheet 20 and a copper plating film 30 formed on at least one surface of the base steel sheet 20. The copper-plated film 30, when a cross section parallel to a thickness direction is viewed, comprises a base film portion 31 continuously covering the base steel sheet 20 and projection portions 32 dendritically grown from the base film portion 31. The volume proportion of the projection portions 32 in a range extending from the base film portion 31 to the height of 10 µm is 0.10% or higher.
Disclaimer: Curated by HT Syndication.
