MUMBAI, India, Aug. 17 -- Intellectual Property India has published a patent application (202617083023 A) filed by Tanaka Electronics Co. , Ltd. on July 06, 2026, for Copper Bonding Ribbon, Method For Manufacturing Copper Bonding Ribbon, And Semiconductor Device.
Inventors include Matsuzawa Osamu; Mitoma Shuichi; Murata Keisuke; and Matsunaga Shizu.
The application for the patent was published on August 14, 2026, under issue no. 33/2026.
Abstract: The purpose of the present invention is to provide a copper bonding ribbon capable of securing bonding strength without damaging an object to be bonded, extending the life of the cutter, reducing electric conductivity, and suppressing oxidation progress of the surface of the copper ribbon. This copper bonding ribbon comprises a copper alloy having a copper purity of 99.99 mass% or more. The copper alloy contains 5-40 ppm by mass of silver, 0-10 ppm by mass of phosphorus, 0-8 ppm by mass of iron, silicon, arsenic, and antimony, respectively, with respect to the total amount. The total content of phosphorus, iron, silicon, arsenic, and antimony is 0-30 ppm by mass. In a cross section perpendicular to the longitudinal direction, the ratio of the corresponding grain boundary length to the total length of the crystal grain boundary is 30% to less than 60%, (1) the arithmetic average roughness Ra in the longitudinal direction of the plane is 30-150 nm, (2) the arithmetic average roughness Ra in the direction perpendicular to the longitudinal direction of the plane is 30-150 nm, and the value obtained by dividing (1) the arithmetic average roughness Ra in the longitudinal direction by (2) the arithmetic average roughness Ra in the direction perpendicular to the longitudinal direction is 0.75-1.15.
Disclaimer: Curated by HT Syndication.
