MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202611115970 A) filed by Graphic Era Deemed To Be University on September 28, 2026, for Copper-Based Metal Matrix Hybrid Composites Reinforced With Recycled Stainless Steel Chips For Enhanced Friction And Wear Performance.
Inventors include Manvandra Kumar Singh; and Gopal Ji.
The application for the patent was published on October 30, 2026, under issue no. 44/2026.
Abstract: The invention relates to copper-based metal matrix hybrid composites and stir-casting methods for producing bulk engineering materials. A copper matrix is reinforced with waste stainless steel chips in an amount of 1 wt.% to 4 wt.%, together with tungsten carbide and chromium at constant proportions, to form uniformly distributed reinforcement structures in compositions HC-WSSC1 to HC-WSSC4. Compared with conventional copper composites, the invention provides technical advancement through productive reuse of machining waste, improved reinforcement dispersion, increased Brinell hardness, and enhanced dry sliding wear resistance with increasing waste stainless steel chip content, while density decreases across the developed formulations. The process includes obtaining machining waste stainless steel chips, introducing the chips, tungsten carbide, and chromium into processable copper under stirring, and solidifying the melt to obtain a coherent hybrid composite body. The composite is useful for wear-resistant copper engineering components.
Disclaimer: Curated by HT Syndication.
