MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202547090770 A) filed by Dowa Metaltech Co. , Ltd. on September 23, 2025, for Copper Alloy Sheet Material, Method For Producing Same, And Current-Carrying Component.
Inventors include Miyahara Ryosuke; Sasai Yuta; and Aoyama Tomotsugu.
The application for the patent was published on September 18, 2026, under issue no. 38/2026.
Abstract: [Problem] To provide a Cu-Fe-P-based copper alloy sheet material which exhibits excellent strength and electrical conductivity and also has a higher level of bending workability. [Solution] Provided is a copper alloy sheet material which has a chemical composition containing, in terms of mass%, 0.05-1.10% of Fe, 0.02-0.50% of P, 0-0.50% of Mg, 0-0.80% of Ni, 0-0.80% of Sn, 0-0.80% of Zn, and a total of 0-0.10% of elements other than Fe, P, Mg, Ni, Sn, Zn and Cu, with the remainder comprising Cu. The crystallite size, as determined using the Halder-Wagner method on the basis of integrated widths of peaks in an X-Ray diffraction pattern using Cu- Ka rays on a surface of the sheet, is 30 nm or less. The 0.2% proof stress in a direction perpendicular to the direction of rolling is 450 N/mm2 or more.
Disclaimer: Curated by HT Syndication.
