MUMBAI, India, Sept. 28 -- Intellectual Property India has published a patent application (202647113432 A) filed by Mitsui Kinzoku Company, Limited on September 22, 2026, for Copper Alloy Powder And Method For Manufacturing Laminate Shaped Article Using Said Copper Alloy Powder.
Inventors include Koyama Junichi; and Soma Kentaro.
The application for the patent was published on September 25, 2026, under issue no. 39/2026.
Abstract: [Problem] To provide a copper alloy powder which is for laminate shaping and from which a laminate shaped article having excellent conductivity and high relative density can be obtained. [Solution] This copper alloy powder for laminate shaping contains Cr, with the remainder consisting of Cu and inevitable impurities, and has a ratio R of 0.1-10, wherein the ratio R is represented by the expression R=Af/Ab (in the expression, Af represents an X-ray absorption spectrum derived from Cr having a face-centered cubic structure, in a spectrum obtained by X-ray absorption near edge structure (XANES) analysis of the copper alloy powder, and Ab represents an X- ray absorption spectrum derived from Cr having a body-centered cubic structure, obtained by XANES analysis of the copper alloy powder).
Disclaimer: Curated by HT Syndication.
