MUMBAI, India, Sept. 28 -- Intellectual Property India has published a patent application (202531026454 A) filed by Siksha O Anusandhan Deemed To Be University on March 22, 2025, for Cooling Tower’s Fill Relocation Device.
Inventor includes Dr. Manita Das.
The application for the patent was published on September 25, 2026, under issue no. 39/2026.
Abstract: A cooling tower’s fill relocation device, comprising a platform 101 positioned on a ground surface, an extendable plates 102 developed to securely accommodate plurality of fill materials used in cooling towers by a user, an imaging unit 103 installed on one of plates 102 determine dimension of fill materials, multiple robotic grippers 104 securely grip fill materials, a U-shape frame 105 is adapted to be rigidly installed on ground surface, and is installed with two sliders 106 that translate platform 101 in upward/downward direction while handling fill materials, a pair of motorized cable pulley 107 is installed on horizontal portion of frame 105, to initiate movement of platform 101, transporting fill material to a designated location.
Disclaimer: Curated by HT Syndication.
