MUMBAI, India, Sept. 28 -- Intellectual Property India has published a patent application (202511103446 A) filed by Carevego Solutions Private Limited on October 27, 2025, for Cooling Assembly.
Inventors include Aashish; Gadre, Dr. Dhananjay V.; and Prashant.
The application for the patent was published on September 25, 2026, under issue no. 39/2026.
Abstract: A cooling assembly (100) for maintaining a substance at a target temperature, includes at least one thermoelectric cooling (TEC) module (105), each TEC module (105) including a cold side (105a) and a hot side (105b). A heat sink (115) is thermally coupled to the hot side (105b) of the TEC module (105) and a fan (120) is configured to dissipate heat from the heat sink (115). First, second and third temperature sensors (155, 160, 165) are provided to measure an ambient temperature (T1), a cold side temperature (T2) and a hot side temperature (T3), respectively. A processing unit (140) is configured to: receive measured values of the ambient temperature (T1), the cold side temperature (T2) and the hot side temperature (T3); and adjust at least one of: a biasing voltage of the at least one TEC module (105) or a speed of the fan (120), based upon the measured values of the ambient temperature (T1), the cold side temperature (T2) and the hot side temperature (T3) using a parametric linear regression analysis.
Disclaimer: Curated by HT Syndication.
