MUMBAI, India, Aug. 31 -- Intellectual Property India has published a patent application (202421096844 A) filed by Vertiv Corporation on December 07, 2024, for Cooling Arrangement For A Thermoelectric Cooling Module.
Inventors include Srinivasan Natarajan; Pramod Dalvi; Utkarsh Diliprao Charapale; and Kishan Jaysukh-Bhai Jethva.
The application for the patent was published on August 28, 2026, under issue no. 35/2026.
Abstract: ABSTRACT COOLING ARRANGEMENT FOR A THERMOELECTRIC COOLING MODULE A cooling system for a TEC module (56) may include a cold plate (102) including a base (104) and a top body (106) mounted thereon at a predetermined distance from the base (104), where the base (104) and the top body (106) may be configured to create an enclosure therebetween to facilitate fluid flow. The cold plate (102) may include an inlet (116) and an outlet (118), where the inlet (116) and outlet (118) may be configured to allow fluid to flow through the enclosure. The cold plate (102) may include a plurality of internal ribs (120) configured on the base (104), where the plurality of internal ribs (120) may include a plurality of holes (122) configured to facilitate fluid dispersion and turbulence. The cold plate (102) may include a plurality of ridges (124) configured on the base (104) between a pair of the plurality of internal ribs (120), where the plurality of ridges (124) may be configured to disrupt laminar fluid flow and create turbulence to enhance heat transfer efficiency. FIG. 2
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