MUMBAI, India, Sept. 28 -- Intellectual Property India has published a patent application (202644034675 A) filed by Te Connectivity Solutions Gmbh on March 23, 2026, for Contact Assembly, Contact Bundle And Plugging Device.
Inventors include Heller, Christian; Raab, Stefan; Braun, Stefan; and Kraenzlein, Harald.
The application for the patent was published on September 25, 2026, under issue no. 39/2026.
Abstract: The invention relates to a contact assembly (1) for a plugging device (2) of a charger, wherein the contact assembly (1) is configured to be held in the plugging device (2) and to be contacted by a mating contact (6) of the charger, wherein the contact assembly (1) comprises an electrically conductive contact element (8) and a holding body (10) that surrounds the contact element (8) at least in part from outside, wherein the holding body (10) comprises at least one other material than the contact element (8). The use of different materials for the holding body (10) and the contact element (8) and the resulting flexibilized material selection leads to freedom of design. The invention further relates to a contact bundle (4) and a plugging device (2). (Figure 1)
Disclaimer: Curated by HT Syndication.
