MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647094318 A) filed by Qualcomm Incorporated on August 04, 2026, for Conductive Paste Vss Shorting For Ground Bumps.
Inventors include Patil, Aniket; Chen, Yujen; and Wang, Zhijie.
The application for the patent was published on August 07, 2026, under issue no. 32/2026.
Abstract: In an aspect, an integrated circuit (IC) device includes a substrate having a non- conductive film disposed on a first surface, a die having a plurality of pins including VSS pins and non-VSS pins having an insulating layer, wherein the plurality of pins is coupled to the substrate through the non-conductive film, and a conductive underfill disposed between the die and the substrate, wherein the conductive underfill is coupled to the VSS pins.
Disclaimer: Curated by HT Syndication.
