MUMBAI, India, July 24 -- Intellectual Property India has published a patent application (202527105819 A) filed by Dexerials Corporation on November 01, 2025, for Conductive Adhesive Film, Method For Manufacturing Conductive Adhesive Film, Connection Body, And Method For Manufacturing Connection Body.
Inventors include Shinohara, Seiichiro; and Tanaka, Yusuke.
The application for the patent was published on July 17, 2026, under issue no. 29/2026.
Abstract: Provided is an conductive adhesive film that can efficiently use conductive particles, supports the miniaturization of the electrode size of an electronic component and fine pitch conversion thereof, and can ensure conduction reliability between connection electrodes and insulation performance between adjacent electrodes. A conductive adhesive film 1 comprises a base material 2 and an adhesive material layer 4, which is provided on one surface of the base material 2 and contains conductive particles 3. The conductive particles 3 contained in the adhesive material layer 4 constitute a particle aggregate 5 in which a plurality of conductive particles are aggregated. In the adhesive material layer 4, array elements 6 each comprising the particle aggregate 5 are arranged in a prescribed arrangement pattern corresponding to an electrode arrangement of an electronic component 10 to which the conductive adhesive film 1 is affixed.
Disclaimer: Curated by HT Syndication.
